Capabilities 

Repair

Soldering Capabilities Include: Through Hole, Surface Mount, BGA. 

Inspection Capabilities Include: X-Ray and Visual. X-Ray and Visual reports can be generated upon customer request for a fee if not part of the original repair service. 

Testing Capabilities are omitted as they are proprietary in nature. 

Repairing 99% of Miller circuit boards and most Lincoln circuit board. Also repairing ESAB, Thermal Arc, Thermal Dynamics, Powcon, Hobart, and others.